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Electronic Design Automation (EDA) tools are critical for designing silicon chips. In the cloud, pay-per-use mechanisms are the norm, but this traditionally isn’t the case for EDA licensing which can limit organizations’ ability to scale EDA on AWS. Synopsys Cloud Bring Your Own Cloud (BYOC) with FlexEDA is a groundbreaking solution that addresses this need.
Consumer demand for feature-rich, power-efficient smart devices is driving silicon design complexity to new heights, with chips containing more than 100 billion transistors already available today. To meet this growing demand, designers are employing the latest chip manufacturing technology processes, which are now entering the angstrom era. Additionally, advanced 3D packaging techniques and chiplets are becoming mainstream and are adding even more complexity that needs to be taken into account.